IDOOS

Integrated Deep Ocean Observation System

IDOOS is the first observational platform designed to provide an integrated view of the physical, biogeochemical, and geophysical processes occurring in the deep and hadal ocean along the Chilean margin, with a particular focus on the Atacama Trench.

What does it observe?

The system is equipped with instruments and sensors that continuously monitor key variables to better understand deep-ocean dynamics, including:

  • Deep and hadal ocean currents.
  • Temperature, salinity, and pressure (CTD).
  • Dissolved oxygen (O₂).
  • Particle and sediment flux.
  • Seafloor pressure associated with tectonic deformation.
Scientific significance IDOOS enables sustained observations of one of the world's most extreme and tectonically active marine environments, providing unprecedented data on deep circulation, renewal of water masses within the trench, particle transport, and seafloor deformation along the Chilean margin.
  • Milestones
    2023 – SONNE International Expedition: Deployment of the first seafloor pressure sensors (FETCH AZA).
  • 2023 – IDOOS I Expedition (R/V Abate Molina): Deployment of the first oceanographic moorings.
  • 2024 – IDOOS II Expedition (R/V Cabo de Hornos): Recovery, maintenance, and redeployment of the moorings, along with the deployment of a lander.
  • 2025 – IDOOS III Expedition (R/V Cabo de Hornos): Acoustic data retrieval (FETCH AZA), recovery of two seafloor pressure sensors, and deployment of a lander.
  • 2025 – DIZMO Expedition (R/V Cabo de Hornos): Recovery of the trench mooring and acoustic data retrieval (FETCH AZA), in collaboration with the DEOX Nucleus and the Chilean Navy.

Current status

The oceanographic moorings have now been recovered, and the instruments are currently undergoing maintenance, inspection, and calibration in preparation for future redeployment. Meanwhile, part of the geophysical network of pressure sensors remains operational on the seafloor, maintaining an active observational component of the IDOOS system.